 Semicon Associates metal processing machines quality components
from refractory materials for use in high vacuum microwave devices, radar,
missile guidance systems, x-ray and medical laser devices, electric propulsion,
ion neutralizers and other various applications that require metal processing.
Semicon Associate's particular expertise is in manufacturing precision parts
ranging from less than 0.1" to 8.0" (2.54mm to 203.2mm) in diameter.
Materials Include:
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High purity Tungsten billets with densities from 65% - 85%
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Tungsten-Iridium
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Sintered and vacuum arc cast Molybdenum
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Molybdenum-Rhenium
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Titanium-Zirconium Molybdenum (TZM)
Capabilities Include:
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Precision gun drilling (straightness of ~.001"/ft [0.0254mm/m] in lengths up to
6.0" [152.4mm])
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Precision milling
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Custom or intricate work on assemblies
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Large billet isostatic pressing of metal and/or ceramic powders (sizes up to
16.0" [406.4mm] in diameter with isostatic pressure of 30,000 psi [207MPa])
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Sintering, annealing and brazing processes with precision jigging
 Machining for metal processing and the processing of other materials are
performed on CNC work centers. CAM and 3-D modeling enable efficient
programming and tooling setup. Close tolerances are achieved to within +/-
.0005" (+/- 0.0127mm) with excellent surface finished.
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